First details of the FlexPai 2: Snapdragon 865 and display a fully flexible Cicada Wing, third-generation

It was in October of 2018 when, outpacing the rest of manufacturers, Royole officially announced what they themselves defined as the “the first smartphone with folding screen trade”. His name was FlexPai, it had a flexible screen AMOLED 7.8-inch (1920 x 1440 pixels) and carrying the Snapdragon 855. Its price started from the 1.388 dollars.

Now, a year and a half later, the company it has shown its successor, the FlexPai 2at an event held in China and, although it has not been presented as such, yes that has been confirmed several important details. Among them, we will see the third generation of flexible panels Cicada Wing and will have as its brain, the processor most advanced of Qualcomm to date, the Snapdragon 865, which means that it will be compatible with the networks 5G NSA and SA.

Improvements in performance, in folding and display

Royole has presented the next generation -and go three – of your screen that’s totally flexible (FFD, Fully Flexible Display) Cicada Wing and has confirmed that the first product to include it will be your new smartphone folding FlexPai 2, which will hit the market in the second quarter of this year.

The CEO of Rayole, Bill Liu, has also announced a strategic agreement with ZTEthat will most likely result in a flip phone, ZTE with this screen. Have not given details on this alliance, except that “the two parties will work together to promote the popularization and application of rapid screens are totally flexible in the era 5G”.

The screen Cicada Wing FFD third generation offers significant improvements over the previous generation, including an increase of 50% brightness and enhanced performance in other metrics, optical, as well as a range of colors 1.3 times better, a contrast 5 times higher and a response time 1.2 times faster. In addition, it has improved the viewing angle, so that the screen promises an accurate representation and vivid color and brilliant images from any perspective.

This panel is also equipped with a new chip of an integrated circuit, the custom handler to improve the quality of the images. You can achieve a minimum bending radius of only 1 mm and, according to Royole, provides an experience of folding more smooth even after folding it over 200,000 times. In addition, it presents almost 100 micro-nano materials to improve the recovery of the voltage, and the “peeled layer” (bubbles and wrinkles that appear when you display the panel), and features the patented technology ULT-NSSP of Royole, which consists in a process of semiconductor without silicon temperature ultra low.

As we said, the FlexPai 2 will be the first product with screen Cicada Wing FFD third generation, with a diagonal of 7.8 inches and an aspect ratio of 4:3. Royole explained in the event the performance and the design of FlexPai 2 have also been improved through the adoption of “technologies of computation, memory, and structural materials of last generation”.

This includes, on the one hand, the Snapdragon processor 865, with the GPU Adreno 650 and modem 5G integrated, RAM LPDDR5 and storage UFS 3.0, and on the other, a new hinge patented (hinge 3S) – building premium, wear-resistant, mechanically robust and no steps. To know the rest of features, we will have to wait for the official presentation of the device.

More information | Royole

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First details of the FlexPai 2: Snapdragon 865 and display a fully flexible Cicada Wing, third-generation

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Xataka Android

by
Laura Sexton

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